Download Digital Integrated Circuits Analysis And Design By John E. Ayers

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Introduction

No field of enterprise today is more dynamic or challenging than that of digital integrated circuits. Since the invention of the integrated circuit in 1958, our ability to pack transistors on a single chip of silicon has doubled roughly every 18 months, as described by “Moore’s law.” Therefore, the functionality and performance of digital integrated circuits have improved geometrically with time. This exponential progress is unprecedented in any other industry or segment of the world economy, and has revolutionized the way we live and work. Because of its very nature, the field of digital integrated circuits has rapidly outrun the numerous good books available on the topic. In response, some authors have adopted the approach of narrowing the focus to a single sub- field, with the goal of covering an ever-increasing wealth of technology. None, however, has made a clear transition to the modern multidisciplinary practice of digital integrated circuits. Traditionally, engineers at the materials, process, device, circuit, and system levels worked quite separately. VLSI design rules developed by Mead and Conway freed the circuit designer from the need to understand the details of device design or fabrication. Rapid progress in scaling transistor dimensions has rendered it impossible to compartmentalize our expertise in this way, however. Engineers working in the field of digital integrated circuits must understand materials, physics, devices, processing, electromagnetics, computer tools, and economics, as well as circuits and layout design rules. Recent innovations in interconnect, such as copper and low k dielectrics, came about by the application of materials, processing, circuit, and electromagnetics principles. The emergence of silicon-on-insulator (SOI) resulted from the application of materials, processing, and device physics as well as circuit theory. At the same time, yield and economic issues have guided the course of SOI development to where it is today. Successful implementation of a system on chip (SOC) can be done only with an understanding of process, yield, economic, and packaging trade-offs. Emerging memory technologies have benefited from interdisciplinary work in physics, materials, and devices. The interdisciplinary nature of the field is highlighted by ovonic unified memory (OUM), which borrows materials technology from rewritable compact disks.

Table of Contents

Chapter No 1 Introduction to Digital Integrated Circuits.
Chapter No 2 Semiconductor Materials
Chapter No 3 Diodes
Chapter No 4 Bipolar Junction Transistors
Chapter No 5 Transistor–Transistor Logic
Chapter No 6 Emitter-Coupled Logic
Chapter No 7 Field-Effect Transistors
Chapter No 8 NMOS Logic
Chapter No 9 CMOS Logic
Chapter No 10 Low-Power CMOS Logic
Chapter No 11 BiCMOS Logic
Chapter No 12 GaAs Direct-Coupled FET Logic
Chapter No 13 Interfacing between Digital Logic Circuits
Chapter No 14 Interconnect
Chapter No 15 Bi stable Circuits
Chapter No 16 Digital Memories
Chapter No 17 Design and Layout
Chapter No 18 Integrated Circuit Packages